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舰载电子设备循环风冷式密闭机柜 被引量：6

A circular wind-cooled airtight cabinet for shipborne electronic equipment
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摘要 介绍了一种循环风冷式密闭机柜的结构形式和设计要点,并给出了该机柜高低温环境试验的数据。 The structure and key points of design of a circular wind-cooled airtight cabinet for shipborne electronic equipment are introduced. Besides, the data of high and low temperature tests of the cabinet is given.
作者 刘永 徐晓
机构地区 海军驻南京地区航天机电系统军事代表室 南京船舶雷达研究所
出处 《雷达与对抗》 2008年第4期53-55,共3页 Radar & ECM
关键词 舰载电子设备 机柜 密闭 冷却 shipborne electronic equipment airtight cabinet cooling
分类号 TN957.83 [电子电信—信号与信息处理]
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参考文献3

二级参考文献24

  • 1徐德好.微通道液冷冷板设计与优化[J].电子机械工程,2006,22(2):14-18. 被引量：24
  • 2Azar K. Advanced cooling concepts and their challenges [ J]. Invited talk given at the Eighth International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Madrid, Spain, 2002,10:1 -4.
  • 3James Marthinuss and George Hall. Northrop Grumman Air Cooled Compact Heat Exchanger Design For Electronics Cooling [ EB/OL ]. www. electronics - cooling, corn/articles/ 2004/2004_february_a3. php.
  • 4Seo Young Kim, Jin Wook Paek, and Byung Ha Kang. Thermal Performance of Aluminum - Foam Heat Sinks by Forced Air Cooling[J]. IEEE Transactions on Components and Packaging Technologies. 2003,26( 1 ) :262 -267.
  • 5Ken I, Salas and Anthony M. Waas convective heat transfer in open-cell Metal Foams[ R] . AIAA 2006.
  • 6Seo Young Kim, Myung Ho Lee, and Kwan-Soo. Lee Heat Removal by Aluminum-Foam Heat Sinks in a Multi-Air Jet Impingement [ J ]. IEEE Transactions on Components and Packaging Technologies. 2005,28 ( 1 ) :142 - 148.
  • 7Zhao C Y, Kim T, Lu T J, Hodson H P. Modelling on Thermal Transport in Cellular Metal Foams [ R ] . AIAA 2002 - 3014.
  • 8Ju Hyun Yoo , Jae Hong , Wenwn Cao. Piezoelectric ceramic bimorph coupled to thin metal plate as cooling fan for electronic devices [ J ]. Sensors and Actuators. 2000, 79 (1) :8-12.
  • 9Leland J E, Ponnapban R. Experimental Investigation of an Air Micro-Jet Array Impingement Cooling Device [ R ]. AIAA-991-0476.
  • 10Seo Young Kim, Myung Ho Lee, and Kwan-Soo. Lee Heat Removal by Aluminum-Foam Heat Sinks in a Multi-Air Jet Impingement[ J ]. IEEE Transactions on Components and Packaging Technologies. 2005,28 ( 1 ) :142 - 148.

共引文献30

同被引文献44

引证文献6

二级引证文献29

雷达与对抗
2008年 第4期

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