摘要
介绍了当今微电子封装中重点关注的铜键合引线,指出了铜键合线的优缺点。铜线键合是一种代替金和铝键合的键合技术,人们关注它不仅因为它的价格成本优势,更由于铜线特有的机械和电学等方面的优良性能,当然,铜线键合技术还存在不少问题和挑战,针对这些存在的问题,进行了简要的介绍并提出相应的解决办法。
The Copper bonding wires that are popular in modern electronic packaging was introduced. Copper wire is an alternative bonding wire to Au and Al. The use of copper is driven not only by its low cost, but also by its excellent mechanical and electrical properties. The advantages and disadvantages of a copper wire were discussed. Some problems and challeges about this new technology and their solutions were presented.
出处
《电子产品可靠性与环境试验》
2008年第6期39-42,共4页
Electronic Product Reliability and Environmental Testing
