摘要
加固计算机作为特殊电子产品,长期置于恶劣的环境条件下,高温工作特性成为制约其工作性能的重要因素。实践证明在项目开发的初期阶段制定合理的热设计方案成为解决高温散热问题的关键。借助有限元热分析软件,热设计工程师可以方便快速地分析散热问题,并进行优化设计。通过对加固计算机进行有限元热分析研究及热设计优化,可总结出电子设备热设计需重点关注的几个问题,案例分析证明这些规则具有一定的通用性。
Rugged computer is an especial kind of electronic manufactures, which should be used in execrable environment. One of the important capacities is the ability to keep the working order under the high temperature. It has been established that at the beginning of a new project, the reasonable thermal design precept is the sticking point to resolve the problems which should happened in the high temperature. With the finite element thermal analysis software, engineers could convenient draw and optimize the blue print. With the discussion on a few questions, which should be given special notice when doing thermal design for electronic manufactures,and reaches a conclusion on the basis of thermal analysis and optimization design of finite element rugged computers. The ease proves that the rules are currency.
出处
《现代电子技术》
2009年第2期85-90,共6页
Modern Electronics Technique
关键词
加固计算机
有限元
热分析
数值仿真
热设计
rugged computer
finite element
thermal analysis
numerical simulation
thermal design
