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Sn-0.7Cu无铅钎料的压入蠕变行为研究 被引量:3

Investigation of Indentation Creep Behavior of Sn-0.7Cu Lead-free Solder
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摘要 采用自制的蠕变装置研究Sn-0.7Cu合金钎料在温度为60~120℃,压力为30~50MPa下的压入蠕变性能,并利用SEM和XRD对合金蠕变前后组织的变化进行分析。结果表明,随温度和应力的增加,合金的蠕变速率增大,稳态蠕变速率符合半经验公式,并得出了该合金的本构方程。通过对其蠕变后应力指数、蠕变激活能及显微组织变化的分析,压入蠕变变形机制主要由位错攀移引起。 The indentation creep behavior of Sn-0. 7Cu alloy was investigated on a self-made apparatus in the temperature rang of 60 -120 ℃ and at different compressive stress between 30 MPa--50 MPa, and the microstructural evoluation before and after creep was analyzed by SEM and XRD. The results show that the creep rate increases with increasing temperature and compressive stress. The steady creep rate is in accordance with an empirical equation and the constitutive equation of the steady-state creep rate is obtained. By analyzing the stress exponent, activation energy and the change of microstrucutre before and after creep, the indentation creep deformation is mainly caused by dislocation climb.
作者 廖春丽 曾明
出处 《铸造技术》 CAS 北大核心 2009年第1期44-47,共4页 Foundry Technology
基金 四川省教育厅重点培育项目(No.07ZZ033)
关键词 Sn-0.7Cu合金 压入蠕变 应力指数 激活能 微观组织 Sn-0.7 Cu alloy Indentation creep Stress exponent Activation energy Microorganization
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