摘要
以单梁-双层密封片为单元建立了指尖密封热分析模型,依据指尖密封的实际工况确定了指尖密封热分析边界条件,通过有限元分析获得了不同工况条件下指尖密封的温度场分布,结果表明指尖密封的最高温度分布区域与高压腔气体温度高低有关,随着高压腔气体温度升高,最高温度分布区域自指尖靴部向高压密封片中部转移.在指尖密封热分析基础上进行了指尖密封热结构耦合分析,获得了考虑热效应的指尖密封的迟滞特性和接触性能.与不考虑温度影响的指尖密封性能分析结果相比,考虑热效应下的指尖密封的迟滞量减小,指尖与转子间的接触压力明显增大.
The thermal analysis model for a repetitive section of single stick, two-layer finger seal was established herein. The thermal analysis boundary conditions were confirmed according to the finger seal＇s working situations. The temperature field in different condi tions of the finger seal sections, including the rotor and the back plate, was obtained using the finite element method （FEM）. It shows that the position of the highest temperature part of the finger seal is related to the upstream temperature. The highest temperature part moves from the finger foot to the middle part of the high pressure finger stick with the in crease of upstream temperature. The coupled thermal and structural analysis of finger seal was also conducted and the finger seal＇s hysteresis and contacting performances considering the thermal character effect were obtained. If compared with the performance analysis results without considering the thermal effect, the hysteresis is lower and the contact pressure between the finger foot and the rotor is much higher with consideration of the thermal effect.
出处
《航空动力学报》
EI
CAS
CSCD
北大核心
2009年第1期196-203,共8页
Journal of Aerospace Power
基金
国家自然科学基金(50575182)
航空科学基金(05C53056)
高等学校博士点基金(20060699021)
关键词
指尖密封
温度场
热结构耦合
finger seal
temperature field
coupled thermal and structural
