摘要
概述了世界电子产品的无铅化趋势及相关立法,比较了世界各国及地区的助焊剂专利文献,分析了助焊剂的研究进展状况,着重论述了微电子组装中无铅钎料专用助焊剂的特点和要求,并提出了开发和研究无铅钎料专用环保型助焊剂需要解决的一些关键问题.最后,归纳了微电子组装无铅钎料专用助焊剂的发展方向和趋势.
This paper summarized the lead-free tendency and its relative legislation of the electronic products in worldwide.Subsistent patent documents and studies of soldering fluxes in different countries and regions were compared.The research status of soldering fluxes was also analyzed.The characteristic and requirement of the soldering fluxes for lead-free solders in microelectronics assembly were described in detail.Some pivotal problems on the development and study of the special soldering fluxes for lead-free solders were put forward,and the fluxes are required to be environmentally friendly.Finally,the trend and prospect of the soldering fluxes for lead-free solders were summed up in microelectronics assembly.
出处
《上海交通大学学报》
EI
CAS
CSCD
北大核心
2007年第S2期53-57,61,共6页
Journal of Shanghai Jiaotong University
基金
国家高技术发展计划(863)资助项目(2002AA322040)
北京市自然科学基金资助(2012003)
关键词
电子组装
无铅钎料
助焊剂
electronics assembly
lead-free solder
soldering flux
