摘要
研究亚铁氰化钾对化学镀铜沉积速度、镀层成分、电阻率、微观结构、表面形貌和化学镀铜过程中氧化还原反应的影响。添加亚铁氰化钾可以显著降低沉积速度,使镀层变得均匀致密,颜色也从棕黑色变为亮铜色,电阻率明显降低。添加亚铁氰化钾还可使镀层P含量略微降低,改善镀层微观结构,晶粒尺寸增大,镀层由(111)晶面择优取向变为(220)晶面择优取向。亚铁氰化钾主要通过吸附作用抑制在镀层表面发生的次磷酸钠氧化反应而降低化学镀铜沉积速度。亚铁氰化钾还可明显降低化学镀铜过程中NaH2PO2/CuSO4消耗摩尔比。
The influences of K4 Fe（CN）6 on the deposit composition, resistivity, structure, morphology and the electrochemical reactions of hypophosphite （oxidation） and cupric ion （reduction） were investigated. The deposition rate and the resistivity of the copper deposits decreased significantly with the addition of K4Fe（CN）6 to the plating solution and the color of the deposits changed from dark- brown to copper-bright with improved uniformity. The content of P in the deposits also decreased slightly with the use of K4Fe（CN）6. Greater crystallite size and preferred orientation of （220） plane were obtained by the addition of K4Fe（CN）6 to the bath. The electrochemical current-voltage results show that K4Fe（CN）6 inhibited the catalytic oxidation of hypophosphite at the active nickel site by ad- sorption on the electrode. This results in lower deposition rate and a decrease in the mole ratio of NaHe PO2/CuSO4 consumed during plating.
出处
《材料工程》
EI
CAS
CSCD
北大核心
2009年第4期39-44,共6页
Journal of Materials Engineering
基金
中南大学博士后科学基金资助项目(200733)
中国博士后科学基金资助项目(20080440178)
关键词
亚铁氰化钾
次磷酸钠
化学镀铜
沉积速度
晶体结构
表面形貌
K4Fe（CN） 6
hypophosphite
electroless copper plating
deposition rate
crystal structure
surface morphology
