摘要
本文介绍了SoC片上总线结构,对CoreConnect协议规范进行详细阐述,重点研究了其多级总线互连结构及功能和效率上的特性。该总线结构适用于具有高性能和高灵活性要求的SoC+ASIC设计环境。
With the development of SoC＇ s on - Chip bus, the CoreConnect protocol is described in detail and the multi - layer interconnect structure as well as the function and efficiency of this protocol is emphasized. It is an OCB designed for SoC plus ASIC environment with special requirement for performance and flexibility.
出处
《湖北第二师范学院学报》
2009年第2期79-82,共4页
Journal of Hubei University of Education
