摘要
随着现代科学技术的高速发展,电子仪器正在向小型化、微型化、高集成化方向迈进。各向异性导电胶作为一种新兴的绿色环保微电子封装互连材料,广泛应用于电子产品中。介绍了各向异性导电胶的组成、分类、结构特点和导电机理,以及影响它的粘接可靠性因素,如粘接工艺参数、导电颗粒的粒径分布、各向异性导电胶的弹性模量、环境干扰等,并对国内外最新文献报道的最新研制成果进行了综述。最后,对各向异性导电胶的发展前景作了展望。
With the rapid development of modern science and technology, the electronic devices are developing towards the direction of minisaturization, mi on and high-integration. Anisotropic conductive adhesive （ACA） is a kind of new and environment friendly interconnected materials in the field of microelectronic packaging, and it is widely used in electronic products. The composition, classification, structure characteristic and electrical conduction mechanisms are introduced. Many factors which have effects on its bonding reliability are studied, such as the bonding process parameters, distribution of diameter of conductive particles, the elastic modulus of ACA and environmental conditions. The latest research progresses at home and abroad are reviewed, as well as the prospect of the development directions of ACA.
出处
《化学与粘合》
CAS
2009年第3期57-60,77,共5页
Chemistry and Adhesion
关键词
各向异性导电胶
粘接可靠性
微电子封装
进展
Anisotropic conductive adhesives
bonding reliability
microelectronic packaging
progress
