摘要
针对多层陶瓷电容器一种自主研发的瓷料的银电极匹配问题,运用扫描电子显微镜分析了端电极烧结后的微观结构,并用能谱仪对其进行成分分析,结合实际的生产实践,找出与该瓷料匹配的银浆料。端电极用银浆由有机载体、玻璃料和银粉等组成。经封端、烘干和烧端形成ML-CC的端电极。实验结果表明:用2#银浆作端电极的MLCC具有附着力高、损耗低等特点,完全能满足该系列MLCC生产线的使用要求。
Aim at the matching problem of a kind of independent research and development of ceramic materials for muhilayer ceramic capacitors devices, the microstructure and components are studied with SEM and EDS. The silver paste for termination electrode of MLCC is co vehicle, glass frit, silver powder and others. The termination electrodes are formed after dipping, drying and terminal firing. Results of experiments indicate that 2# silver paste for electrode of MLCC has high adhesion and low DF, and is well fit for MLCC.
出处
《电子工艺技术》
2009年第4期214-217,共4页
Electronics Process Technology
基金
国防科工委共性基金资助项目
关键词
MLCC
微观结构
银端浆
MLCC
Microstructure
Silver termination paste
