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印刷线路板加工工艺制作微腔等离子体阵列

Arrays of Microplasma Devices Fabricated by Printed Circuit Board Processes
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摘要 采用印刷电路板工艺制作了微腔等离子体阵列,并测量了该阵列的放电特性。该器件采用标准的印刷线路板工艺制作而成,可以降低微腔等离子体器件制作的难度和提高阵列的一致性。实验结果表明,限流电阻为10kΩ情况时,直径100μm,间距150μm的微腔在一个大气压的氖气中放电电流最大值可达30mA。随着驱动电压的增加,放电电流的最大值不断升高而放电延时不断降低。 Arrays of microplasma devices fabricated by printed circuit board processes were proposed and the discharge characteristics of the arrays were measured. The fabrication processes could reduce the cost and production complexity of the devices. The experiment results show that the peak discharge current of each microcavity could reach about 30mA with a ballast resistor of 10kΩ. The peak discharge current of the arrays goes up and the discharge delay time goes down with the increase of the pulse power supply value.
作者 陈岗
机构地区 山东警察学院
出处 《信息技术与信息化》 2009年第3期70-71,共2页 Information Technology and Informatization
关键词 微腔等离子体阵列 印刷线路板工艺 放电电流 放电延时 Microcavity plasma arrays Printed circuit board Discharge current Discharge delay time
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参考文献7

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