摘要
采用含有Ｙ２Ｏ５，Ａｌ２Ｏ３，ＳｉＯ２和Ｓｉ３Ｎ４的焊料在１６００℃，３０ｍｉｎ，５ＭＰａ压力的条件下对无压烧结氮化硅陶瓷进行连接实验，研究焊料中氮化硅的摩尔分数对连接强度的影响．结果表明，随着氮化硅摩尔分数的增加，连接强度也得以提高，这主要是因为氮化硅的加入降低了焊料的热膨胀系数以及加速了结合层内焊料的氮化过程．但是，氮化硅摩尔分数进一步增加，导致焊料的粘度增加，影响了焊料在陶瓷表面的润湿和铺展，使连接强度下降．Ｃ焊料在连接过程中转变成β－Ｓｉ３Ｎ４与氧氮玻璃的体积比等于５０∶５０的复合焊料，其连接强度最大，平均为５５０ＭＰａ，达到基体氮化硅陶瓷抗弯强度的８０％．
Pressureless sintered silicon nitride ceramics are joined using Y 2O 3, Al 2O 3, SiO 2 and Si 3N 4 adhesives at 1600℃ for 30min under a load of 5MPa in this paper, then the effects of silicon nitride content in the adhesives on the bonding strength of the joints are studied. The results show that the bonding strength is improved with the increase of mole fraction of silicon nitride in the adhesives, because the thermal expansion coefficient of the adhesives is reduced and the nitriding process in the adhesive is accelarated by the addition of silicon nitride powder. However, when the mole fration of silicon nitride is further increased, the bonding strength begins to decrease due to the increasing viscosity of the adhesive which has a negative effect on the wetting and spreading of the adhesive, Adhesive C composed of 28% α -Si 3N 4 in mole fraction in the paper is converted to an approximate volume ratio 50∶50 composite of β -Si 3N 4-glass-ceramics, and use of this adhesive will yield a maximum bonding strength of 550MPa, i. e., 80% of that of the unbonded material.
出处
《硅酸盐学报》
EI
CAS
CSCD
北大核心
1998年第4期451-457,共7页
Journal of The Chinese Ceramic Society
基金
上海市自然科学基金
关键词
氮化硅
连接
焊料
连接强度
陶瓷
silicon nitride, joining, adhesive, bonding strength
