摘要
低阻抗多孔介质材料具有较低的密度和弹性波速，对其实施动态压缩实验具有一定的难度。本文在充分分析聚氨酯泡沫试件由于低阻抗所带来的各种影响因素后，提出了在ＳＨＰＢ装置上对低阻抗多孔介质材料进行动态测试时所应采取的半导体应变片技术及新的ＳＨＰＢ数据计算模式，初步解决了ＳＨＰＢ装置上对低阻抗多孔介质测试的难点。
Because of the much lower density and wave velocity for some porous materials, there exist difficulties in the dynamic compression test of these materials. Based on the analysis for the effects of low wave impedance of materials upon the test data in dynamic compression test by Split Hopkingson Pressure Bar, the measurement technology of semiconductor gage and a new data processing model are suggested, and problems are solved to some extend.
出处
《实验力学》
CSCD
北大核心
1998年第2期218-223,共6页
Journal of Experimental Mechanics
基金
中国工程物理研究院基金
关键词
多孔介质
半导体
应变片测量
冲击载荷
SHPB
porous material, measurement technology of semiconductor strain gage, Split Hopkinson Pressure Bar
