期刊文献+

叠层片式LTCC低通滤波器的设计与制作 被引量:2

Design and Fabrication of Laminated Low Pass Filters
下载PDF
导出
摘要 利用集总参数元件进行叠层片式低通滤波器的设计,并使用ULF140材料,经低温共烧陶瓷(LTCC)工艺制作出符合0805封装尺寸要求的截止频率为200MHz的叠层片式低通滤波器。用矢量网络分析仪Agilent 8722ES对样品进行了相关测试,测试结果为:滤波器3dB的频率点为200MHz,500MHz时带外抑制达到26dB。其仿真结果与实测结果吻合。采用该方法,解决了设计和制作LTCC叠层低通滤波器的一致性问题。 A complete and effective design is introduced to realize the 0805 size of standard packaging laminated low pass filter (LPF) using the technology of low temperature co-fired ceramic (LTCC). The three-stage laminated LPF with 200 MHz cut-off frequency is successfully manufactured using the ceramic green tape with relative permittivity of 14 and tape-casting thickness of 25 μm. Testing results show that the three-order LPF sample can achieve a 3 dB return loss at 200 MHz and a 26 dB return loss at 500 MHz by Agilent 8722ES. And the measured results agree well with the simulated data. This method illustrates a way to resolve the consistency problems between simulation and manufacture.
出处 《电子科技大学学报》 EI CAS CSCD 北大核心 2009年第4期521-524,共4页 Journal of University of Electronic Science and Technology of China
基金 国家自然科学基金(60571017)
关键词 制作 低通滤波器 低温共烧陶瓷 仿真 fabrication LPF LTCC stimulation
  • 相关文献

参考文献10

  • 1WOLFF I. Design and technology of microwave and millimeter wave LTCC circuits and systems[C]//ISSSE '07: International Symposium on Signals, Systems and Electronics. Montreal: IEEE Press, 2007:505-512.
  • 2CHIRIAC V A, LEE T Y T. Thermal assessment of RF-integrated LTCC front end modules[J]. IEEE Transactions on Advanced Packaging, 2004, 27(3): 545-557.
  • 3SHAMIM A, BRZEZINA G; ARSALAN M, et al. 5.2 GHz differential LTCC antenna and balun for biomedical system in package (SIP) application[C]//IWAT'07: International Workshop on Antenna Technology. Cambridge: IEEE Press, 2007: 443-446.
  • 4KIM Ki-il, KIM Jung-Mu, KIM Jong-Man, et al. Packaging method for RF MEMS devices using LTCC capping substrate and BCB adhesive bonding[C]//TRANSDUCERS '05: The 13th International Conference on Solid-State Sensors, Actuators and Microsystems. Korea: IEEE Press, 2005: 1092-1095.
  • 5LI R L, DE JEAN G, MAENG M, et al. Design of compact stacked-patch antennas in LTCC multilayer packaging modules for wireless applications[J]. IEEE Transactions on Advanced Packaging, 2004, 27(4):581-589.
  • 6LI Yuan-xun, LIU Ying-li, ZHANG Huai-wu, et al. The design and fabrication of RF band pass filter by LTCC technology[C]//International Conference on Electronic Packaging Technology & High Density Packaging. Shanghai IEEE Press, 2008: 1-4.
  • 7Xi-Dan Chen Ying-Li Liu Yuan-Xun Li.Multilayer Low Pass Filter Using LTCC Technology[J].Journal of Electronic Science and Technology of China,2007,5(4):374-377. 被引量:1
  • 8MILITARU N, LOGEWSKI G, BANCIU M G Aperture couplings in multilayer filtering structures[J]. Signals, Circuits and Systems, 2007, 2: 1-4.
  • 9VOROTNIKOV B, CHERNYAKOV A, SAKHNENKO S, et al. High performance 2.4 GHz combined LTCC/SAW filter for WLAN applications in mobile phones[C]// European Microwave Conference. Germany: IEEE Press, 2007: 438-441.
  • 10SCRANTOM C Q, LAWSON J C. LTCC technology: where we are and where we're going-Ⅱ[C]//1999 IEEE MTT-S Symposium on Technologies for Wireless Applications. Canada: IEEE Press, 1999:193-200.

二级参考文献8

  • 1A. Sutono,J. Laskar,and W. R. Smith."Design of miniature multilayer on-package image-reject filter,"[].IEEE Transaction on Microwave Theory and Techniques.2003
  • 2P. M. Piel,J. Estes,S. Marshall,G. Funk,and A. Pavio."Low temperature cofired ceramic: an enabler of high power RF integrated amplifiers,"[].IEEE MTT-S Digest.2002
  • 3J. Estes,P. Piel,G. Shapiro,A. Pavio,M. Hurst,J. Call,and G .Funk."An internally matched LTCC 3G WCDMA 180 watt LDMOS power amplifier,"[].IEEE MTT-S Digest.2001
  • 4K. Yutae,S. Pinel,M. Davis,A. Sutono,L. H. Chang,H. Deukhyoun,A. obatoynbo,J. Laskar,E. MTantzeris,and R. Tummala."RF-system-on-package (SOP) for wireless communications,"[].IEEE Microwave Magazine.2002
  • 5S. Chakraborty,K. Lim,A. Sutono,E. Chen,S. Yoo,A. Obatoyinbo,and J. Laskar."Development of an integrated bluetooth RF transceiver module using multi-layer system on package technology,"[].Radio and Wireless Conference.2001
  • 6C. H. Lee,A. Sutono,S. Han,and J. Laskar."A compact Ku-band transmitter module with integrated filter for satellite communication application,"[].IEEE MTT-S Digest.2001
  • 7M. D. O’Hearn."A voltage controlled oscillator using low temperature co-fired ceramics,"[].Proceedings of International IEEE Frequency Control Symposium.1996
  • 8Sutono Albert,Heo Deukhyoun,Chen Yi-Jan Emery,et al.High-Q LTCC-based passive library for wireless system-on-package(SOP)module development[].IEEE Transaction on Microwave Theory and Technique.2001

同被引文献7

引证文献2

二级引证文献6

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部