摘要
研究了回流焊次数对Sn-0.3Ag-0.7Cu-xNi/Cu(x=0,0.05)焊点的界面反应及其剪切强度的影响。结果表明:随着回流焊次数的增加,界面金属间化合物(IMC)Cu6Sn5和(Cu1-xNix)6Sn5的厚度均增加。在钎料中添加w(Ni)为0.05%,可有效抑制IMC的生长,与回流焊次数无关。回流焊次数对Sn-0.3Ag-0.7Cu/Cu和Sn-0.3Ag-0.7Cu-0.05Ni/Cu的剪切强度影响都不大,五次回流焊后剪切强度略有下降,剪切强度分别为21MPa和25MPa。发现断裂面部分在钎料中,部分在钎料和IMC之间。
Effect of reflow soldering cycles on the interfacial reaction between Sn-0.3Ag-0.7Cu-xNi （x=0,0.05）solder and Cu substrate as well as the shear strength of solder joint were investigated. Results show that the thicknesses of Cu6Sn5 layer and （CU1-xNix）6Sn5 layer increase as the reflow soldering cycles increase. The addition of w（Ni） of 0.05% to the solder can decrease the thickness of IMC which is independent of the reflow soldering cycles. Furthermore, the shear strengths of solder joints added with Ni or without Ni don＇t change apparently after the reflow soldering cycles, which are 21 MPa and 25 MPa respectively. The fracture surface is found partly in the bulk solder and partly on the interface between the solder and IMC after five reflow soldering cycles.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2009年第9期73-76,共4页
Electronic Components And Materials
基金
国家自然科学基金资助项目(No.50575060)
哈尔滨市科技创新人才研究专项资金资助项目(No.RC2006QN006012)
