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SiO_2/CE/BMI复合材料固化反应动力学的研究

Study on the curing kinetics of SiO_2/CE/BMI composite
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摘要 通过示差扫描分析法(DSC)研究了SiO2/氰酸酯树脂(CE)/含有活性稀释剂的双马来酰亚胺树脂(BMI)复合材料的固化动力学,求得其固化工艺参数为:凝胶温度87.13℃,固化温度137.27℃,后处理温度203.58℃;用Kissinger法和Ozawa法求得其固化动力学参数为:表观活化能6.692kJ/mol,反应级数1.493,Arrhenius方程中的频率因子11.9445s-1。与CE/BMI体系对比表明,SiO2的加入可以降低CE/BMI体系的活化能,使其固化反应可以在较低温度下进行。 The curing kinetics of SiO2/cyanate ester(CE)/bismaleimide with diluent agent (BMI) composite was studied by differential scanning calorimetry ( DSC ). The curing process parameters were obtained as follews : gel temperature 87.13 ℃, curing temperature 137.27 ℃ and post -treating temperature 203.58 ℃. The parameters of the curing kinetics were calculated by Kissinger and Ozawa methods. The activation energy of the system was 6. 692 kJ/mol. The reaction order was 1. 493 and the frequency factor of the Arrhenius equation was 11. 9445 s^-1. Compared to the CE/BMI system, the results indicated that the addition of SiO2 could lower the activation energy of the CE/BMI system and the curing reaction could occur at a relative low temperature.
出处 《热固性树脂》 CAS CSCD 北大核心 2009年第5期6-8,共3页 Thermosetting Resin
关键词 二氧化硅 氰酸酯 双马来酰亚胺树脂 固化反应动力学 silica cyanate ester bismaleimide curing kinetics
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