摘要
在铝基板表面的氧化铝上实施化学镀铜,获得剥离强度良好的化学镀铜层。利用扫描电子显微镜观察了化学镀铜层的剖面形貌;测定了硅烷化前后氧化铝表面的润湿性;分析了硅烷化时间和施镀时间对氧化铝表面铜厚度的影响。结果表明:在铝基板表面氧化铝上所制得的化学镀铜层与基体结合力良好,可以满足印制线路板的要求。
Electroless copper plating, which shows good peeling strength, was carried out for the deposition of copper on alumina layer covered on aluminum substrate. The cross-sectional morphology of the coatings was studied by SEM. The wettability of alumina surface before and after silanization was measured. Silanization and plating period, which affected the copper coating thickness, were analyzed. The results indicated that excellent adhesion between copper coating and alumina was obtained under optimum conditions and it can meet the demands of print circuit board industry.
出处
《电镀与精饰》
CAS
北大核心
2009年第10期1-4,共4页
Plating & Finishing
基金
江苏省自然科学基金资助项目(BK2008545)
关键词
铝基板
氧化铝
化学镀铜
aluminum substrate
alumina
electroless copper plating
