摘要
传统的半导体封装以铝线和金线为基础。功率器件使用铝线作为连接裸片焊盘与引线框架的互联通道,非功率器件使用金线为互联通道。由于金的价格昂贵,人们一直在寻找替代材料。铜作为物理和化学性质与金接近而价格低廉的金属材料,自然引起人们的关注。文章对铜引线键合工艺的关键问题进行了系统研究。这些研究内容包括自动焊线机的机器参数调整、焊球显微硬度测试、击穿电压测试、焊球高温老化形变、焊球接触电阻测试等内容。这些是铜焊线替代金焊线后影响产品可靠性及产品特性参数的关键问题。通过对机器参数的调整试验得出了适合于大规模生产的工艺参数。
Tranditional semiconductor packages are based on Al wire and Au wire. Power devices normally use Al wire as connection between wire bonding pad of die and leadframe. Other devices except power use Au wire. Because of high cost of Au wire, people have been searching the replacement for it. Cu wire naturally caused the attention because of the physical and chemical characteristics are not big difference from Au wire but the price is much lower. In this paper key problems affecting copper wire processes had been analysed through a series studies. These are wire bonder modifing on hardware and software to reach copper wire requirements, microhardness test, breakage volts test, thermal stability, ball to pad electrical resistance. All these elements have effects on copper wire products reliability and parameters. The differences between copper wire and gold wire had been compared each other to guide the mass production.
出处
《电子与封装》
2009年第10期1-3,13,共4页
Electronics & Packaging
关键词
键合引线
铜引线
引线键合
bonding wire
copper wire
wire bonding
