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基于微控制器的风速风向传感器系统设计 被引量:14

Design of wind sensor system based on microcontroller
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摘要 提出了一种基于惠斯通全桥电路的热式风速风向传感器系统设计方案。传感器芯片结构利用ANSYS软件进行了热学和电学的耦合仿真,并进行了结构优化。芯片采用剥离工艺在陶瓷衬底上加工而成,利用直接安装技术对传感器进行封装。系统采用恒温差工作原理进行控制,热温差工作原理测量风速和风向。系统中微控制器集成的电流型D/A对传感器恒温差控制模式的初始状态进行设定,同时补偿环境温度的变化造成的输出信号的漂移,使得系统的工作温度扩展到-40-60℃。热温差检测模式利用位于片上的8个温敏元件构成两路惠斯通全桥电路连接,这种设计在保证灵敏度的同时提高了其测量范围。本系统的微控制器集成了大量模拟和数字模块,减少片外元件使用量,大幅缩小系统体积,同时能够提高测量系统的测量精度及可靠性。通过风洞测试表明,该系统能够完成360o风向检测,精度达到3°,风速的检测范围达到35 m/s。 This paper proposed an thermal wind sensor system based on Wheatstone full bridge.The sensor structure was optimized by ANSYS software in thermal field and electrical field.The chip was fabricated on the ceramic substrate by lift off process,and packaged by the direct chip packaging technology.The constant tem-perature difference mode is used to control the wind sensor system,which the integrated current-type D/A is in-troduced to set the initial state of this mode and compensate the system fluctuation cased by the drift of ambient temperature,therefore the system working temperature extend from-40 ℃ to 60 ℃.Calorimetric mode adopt eight temperature sensing elements to form two Wheatstone full bridges,so as to improve the testing range and signal sensitivity simultaneity.As the microcontroller integrates a large number of analog and digital components,the number of the off-chip components can be reduced,as well as the size of the system.Wind tunnel test results show that the wind sensor system can detect wind speed up to 35 m/s and wind direction of 360o,the wind direc-tion error is 3o.
出处 《仪器仪表学报》 EI CAS CSCD 北大核心 2009年第10期2144-2149,共6页 Chinese Journal of Scientific Instrument
基金 国家863项目(2007AA04Z306)资助
关键词 MEMS 温度补偿 风传感器系统 智能传感器系统 MEMS temperature compensation wind sensor system smart sensor system
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  • 1高冬晖,秦明,黄庆安.硅热流量传感器封装的热模拟分析[J].Journal of Semiconductors,2005,26(2):368-372. 被引量:6
  • 2[1]Mayer F. , Salis G. ,Funk J. , et al.. Scaling of thermal CMOS gas flow microsensors:experiment and simulation. Micro Electro Mechanical Systems, 1996,MEMS ′96, IEEE, Proceedings, The Ninth Annual International Workshop on, An Investigation of Micro Structures,Sensors, Actuators, Machines and Systems, 1996,116 ~121.
  • 3Makinwa K A A,Huijsing J H,Hagedoorn A.Industrial design of a solid-state wind sensor.Proceedings of the First ISA/IEEE Conference,2001:68
  • 4Mayer F,Haberli A,Jacobs H,et al.Single-chip CMOS anemometer.Technical Digest of Electron Devices Meeting,1997:895
  • 5Kim S U,Kim S,Kim Y,et al.Design and fabrication of a flow sensor detecting flow direction and velocity.12th Innational Conference on Transducers,Solid-State Sensors,Actuators and Microsystems,2003,2:1927
  • 6Mayer F,Salis G,Funk J,et al.Scaling of thermal CMOS gas flow microsensors:experiment and simulation.Proceedings of An Investigation of Micro Structures,Sensors,Actuators,Machines and Systems,1996:116
  • 7Matova S P,Huijsing J H.Three dimensional computer model of a smart wind sensor.Proceedings of SeSens,2001:834
  • 8Van Oudheusden B W.The thermal modeling of a flow sensor based on differential convective heat transfer.Sensors and Actuators A,1991,29:93
  • 9童勤义 黄金彪.CMOS集成硅流量传感器[J].电子学报,1987,(15):112-114.
  • 10Van Oudheusden B. W. Silicon Thermal Flow Sensors[J].Sensors and Actuators A: Physical, 1992, 30(1-2): 5-26.

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