摘要
采用Intel Xeon LV处理器,利用先进的EDA工具和仿真软件进行高速串行总线的合理布局布线,实现了一种支持多主并行处理的加固计算机。根据应用,构建了基于高速互连网络的计算机硬件系统,结合成熟的商用并行软件,对计算机系统并行能力进行了测试;针对抗恶劣环境应用,特别是热设计,通过热分析、建模仿真(Icepak)等手段,实现计算机系统的环境设计。
By using Intel Xeon LV processor and by rational layout and wire for high speed serial bus through EDA tools and simulation software, the type of multiple master parallel processing rugged computer is realized.According to application,test for parallel computer finished basing on computer hardware system and mature commercial parallel software. By thermo analysis and module simulation of Icepak,the thermo design for rugged enviromment application is also completed.
出处
《电子技术应用》
北大核心
2009年第11期122-124,共3页
Application of Electronic Technique
关键词
并行
加固
高速串行
热分析
parallel
rugged
high speed serial
thermo analysis
