摘要
为了摒弃化学镀铜中价格昂贵、环境污染的活化工艺,将分子自组装技术与激光诱导化学镀技术结合,在聚酰亚胺薄膜(PI)上成功实现了图形化微米级金属铜沉积:将PI薄膜通过KOH溶液进行表面水解;经离子交换和高温处理在PI表面束缚纳米银粒子,在PI表面自组装上一层十二硫醇的自组装膜;再用聚焦的激光光刻产生预期的图形,最后实施化学镀后,在PI表面上实现金属铜的图形化沉积。采用XPS,AFM,SEM,ATR-FTIR,半导体特性分析系1统和视频光学接触角测量仪等跟踪表征各过程。结果显示:沉积的铜线宽度为30μm,选择性、导电性良好,本法为化学镀技术提供一种新技术,可用于电子行业。
A new method for molecular self-assemblyand electroless Cu plating of laser-induced patterning on polyim-ide film is reported. Thus the surface of the polyimide film washydrolyzed using aqueous KOH, followed by entrapping of Agnanoparticles via ion-exchange and annealing at elevated temper-ature. Then dodecanethiol monolayer was self-assembled on thepolyimide film doped with Ag nanoparticles. Desired microscalepattern was generated on the self-assembled monolayer by directlaser writing, and copper was then selectively deposited on thepatterned areas by electroless plating. Various processes for pre-paring the patterned electroless Cu coating were analyzed using anX-ray photoelectron spectroscope, an atomic force microscope, ascanning electron microscope, an attenuation total reflectanceFourier transformation infrared spectrometer, a semiconductorcharacterization system, and a video based contact angle meter.It has been found that the deposited copper line has a width of 30urn and good selectivity and conductivity. As a new technologyfor electroless Cu plating, the present process could be well ap-plied in electronic industry.
出处
《材料保护》
CAS
CSCD
北大核心
2009年第11期1-4,共4页
Materials Protection
关键词
分子自组装
激光诱导
化学镀
聚酰亚胺
表面金属化
molecular self-assembly
laser-induced patterning
electroless copper plating
polyimide film
surface metalation
