摘要
较详细地介绍了钯及钯合金镀层的镀液组成、工艺条件及其应用领域。以钯及钯合金镀层代替金镀层将成为电子工业今后的发展方向，其在装饰业亦有可能取代铑、铂镀层。
Bath compositions and plating conditions,and application fields of palladium and its alloy coatings are discussed in detail.Substitution of these coatings for gold ones would become a tendency toward future development in electronic industry. They might also replace rhodium and platinum coatings in decorative industry.
出处
《云南冶金》
1998年第4期48-50,54,共4页
Yunnan Metallurgy
关键词
钯
钯合金
电镀
化学镀
镀层
palladium palladium alloy electroplationg chemical plating
