摘要
当前,集成电路制造中低k介质与铜互连集成工艺的引入已经成为一种趋势,因此分析封装器件中低k结构的可靠性是很有必要的。利用有限元软件分析了倒装焊器件的尺寸参数对低k层及焊点的影响。结果表明:减薄芯片,减小PI层厚度,增加焊点高度,增加焊盘高度,减小基板厚度能够缓解低k层上的最大等效应力;而减薄芯片,增加PI层厚度,增加焊点高度,减小焊盘高度,减小基板厚度能够降低焊点的等效塑性应变。
At present, it has become a trend that low-k dielectric and copper interconnect integration process is introduced in IC manufacturing, so the reliability analysis of the low-k structures in package device is necessary. In this paper, the effects of the size parameters of the flip-chip device on low-k layer and solder joints reliability were investigated by finite element software. The results showed that： thinner die, thinner the PI layer, taller solder joint height, taller Cu pad height, thinner substrate can alleviate the maximum equivalent stress of the low-k layer; while thinner die, thicker PI layer, taller solder joint height, lower Cu pad height, thinner substrate can reduce the equivalent plastic strain of solder joints.
出处
《电子工业专用设备》
2009年第11期6-9,共4页
Equipment for Electronic Products Manufacturing
