摘要
Effects of nano-sized Ag reinforcing particulates on the microstructure of Sn-0.7Cu solder jointsTAI Feng, GUO Fu, XIA Zhidong, LEI Yongping, and SHI YaowuAbstract Composite solders were prepared by mechanically dispersing different volumes of nano-sized Ag particles into the Sn-0.7Cu eutectic solder. The effects of Ag particle addition on the microstructure of Sn-0.7Cu solder joints were investigated. Besides, the effects of isothermal aging on the microstructural evolution in the interfacial intermetallic compound （IMC） layer of the Sn-0.7Cu solder and the composite solder reinforced with 1vol% Ag particles were analyzed, respectively.
Effects of nano-sized Ag reinforcing particulates on the microstructure of Sn-0.7Cu solder jointsTAI Feng, GUO Fu, XIA Zhidong, LEI Yongping, and SHI YaowuAbstract Composite solders were prepared by mechanically dispersing different volumes of nano-sized Ag particles into the Sn-0.7Cu eutectic solder. The effects of Ag particle addition on the microstructure of Sn-0.7Cu solder joints were investigated. Besides, the effects of isothermal aging on the microstructural evolution in the interfacial intermetallic compound （IMC） layer of the Sn-0.7Cu solder and the composite solder reinforced with 1vol% Ag particles were analyzed, respectively.
