摘要
为了进一步提高金属的硬度和强度,采用电铸工艺通过添加剂TN2提高阴极过电位,抑制晶粒生长,制备了超细晶镍钴合金层,研究了电流密度和添加剂TN2对铸层晶粒大小的影响。结果表明:提高电流密度可以细化晶粒,当电流密度从5A/dm2增加到15A/dm2时,晶粒大小从5μm细化到500nm;添加0.15g/LTN2时,铸层表面半光亮,晶粒进一步细化(小于500nm),硬度高达60HRC。
Ni-Co alloy coating was prepared by using electro-forming technology.The effects of current density and additive TN2 on the grain size of the alloy coating were studied by means of scanning electron microscopy and X-ray diffraction.Results show that increasing current density leads to refined grains.As the current density increased from 5 A/dm2 to 15 A/dm2,the grain size decreased from 5 μm to 500 nm.The alloy coating ob-tained in the presence of 0.15 g/L additive TN2 had zero stress and semi-bright surface.And its grain size was smaller than 500 nm,while its hardness was as high as 60 HRC.
出处
《材料保护》
CAS
CSCD
北大核心
2010年第1期36-37,共2页
Materials Protection
基金
国防科工委军品配套项目(JPPT-115-2-676)
关键词
扫描电镜
X射线衍射
晶粒大小
电流密度
添加剂
超细晶
scanning electron microscopy
X-ray diffraction
grain size
current density
additive
ultra-fine grain
