摘要
在对塑封集成电路进行封装可靠性评估中,预处理过程(precondition)是必经的步骤。其中的浸润测试(soak)通常在非加速条件下进行,其耗时较长。在市场竞争日趋激烈的环境下,企业迫切需要缩短新产品的可靠性验证时间。文章针对JEDEC(电子器件工程联合委员会)和JEITA(日本电子信息技术协会)标准中涉及到的三种加速浸润条件,以组件在非加速条件下(JEDEC Level 3和JEITA Rank E)潮气的穿透力、吸收量及由此产生的失效为参照,确定在加速条件下,组件达到同样的潮气吸收量并产生相类似的失效所需的时间。同时应用有限元分析的方法进行建模和计算,并与实际的测量结果比较验证。
In the semiconductor industry,during the component level reliability evaluation, the soak testing in the precondition is normally proceeded under non-accelerated which takes long time. In order to reduce the soak time, three accelerated soak conditions are studied with the reference of non-accelerated soak condition （JEDEC Level 3 and JEITA Rank E）. Under the three accelerated soak conditions, the moisture gain and moisture distribution study are carried and confirmed by FEA （Finite Element Analysis）. Also, the failure is studied under the three accelerated conditions compared with those of non-accelerated soak conditions. Thereby, the time to fail of the component is determined.
出处
《电子与封装》
2010年第1期35-38,42,共5页
Electronics & Packaging
关键词
可靠性
预处理
浸润
有限元分析
分层失效
reliability
precondition
soak
finite element analysis （FEA）
delamination
