摘要
在金属化布线电徙动试验中，采用金属薄膜电阻测温法精确测量了样品的局部温度，在环境温度为150℃，电流密度为3×106A／cm2和5×106A／cm2时，金属薄膜温度分别高于环境温度32．5℃和100℃；提出了扩散电阻测温法，在电徙动试验中精确测量并适时监控样品局部温度，从而实现了电流密度指数因子动态测试．
The sample temperatures were tested in the metallization electromigration experiment. The tests show: that with a metal stripe under the same oven temperature of 150℃, When current density was 3 × 106A / cm2, the stripe temperature was 32.5℃higher than its ambient temperature; while the current density changed to 5 × 106A / cm2,the temperature of the stripe became 100℃ higher than its ambient temperature. Thus the temperature-test method of doped resistance is put forward to monitor and control accurately temperature of metal stripes, and a new dynamic current-ramp method for current density exponent is developed by this method.
出处
《北京工业大学学报》
CAS
CSCD
1998年第4期63-68,共6页
Journal of Beijing University of Technology
