期刊文献+

包装冲击试验机专用虚拟仪器设计 被引量:3

Design of Virtual Instrument Used in Package Impact Testing Machine
下载PDF
导出
摘要 基于虚拟仪器思想,采用LabVIEW编程,利用计算机和数据采集卡开发包装冲击试验机专用虚拟仪器。实现了数据采集、处理自动化,自动完成试验结果分析计算、曲线拟合和冲击谱,免去以往复杂的数据处理过程。 Programming with LabVIEW,using computer and DAQ,a especial virtual instruments for packaging impact testing machine was developed based on the concept of virtual instruments. Automation of data collection and processing was realized,the testing analysis, curve fitting and shock spectrum could be also obtained automatically.
作者 李志强
机构地区 陕西科技大学
出处 《包装工程》 CAS CSCD 北大核心 2010年第7期70-72,共3页 Packaging Engineering
基金 2008年陕西科技大学自然科学基金资助(ZX08-32)
关键词 冲击试验机 虚拟仪器 LABVIEW 动态压缩 冲击谱 impact testing machine virtual instrument LabVIEW dynamic compression shock spectrum
  • 相关文献

参考文献7

二级参考文献24

共引文献32

同被引文献35

  • 1张华良,顾祖莉,金国斌.现代物流中商品运输包装动力可靠性[J].包装工程,2004,25(4):135-137. 被引量:12
  • 2郭彦峰,付云岗,许文才,潘松年.缓冲包装件的运输包装性能测试与评估技术[J].包装工程,2006,27(4):26-28. 被引量:21
  • 3周海.PCI-1712数据采集卡在冲击试验机上的应用[J].试验技术与试验机,2007,47(1):64-66. 被引量:3
  • 4DA Yu,KWAK J B, SEUNGBAE Park, et al. Dynamic Re- sponses of PCB Under Product-level Free Drop Impact J l- Microelectronics Reliability,2010 (50) : 1028-1038.
  • 5汤伯森,奚德昌.包装动力学[M].北京:化学工业出版社.2011.
  • 6MICHAEL A. S, MINETT M, ROUILLARD M, et al. A New Method for the Determination of Cushion Curves [ J ]. Packa- ging Technology and Science,2000( 13 ) :249-255.
  • 7HOKKA J, MATFILA T T, LI J, et al. A novel Impact Test System for More Efficient Reliability Testing[ J]. Microelec- tronics Reliability ,2010 ( 50 ) : 1125-1133.
  • 8CHENG M, DIONNE J P, MAKRIS A. On Drop-tower Test Methodology for Blast Mitigation Seat Evaluation [ J ]. Inter- national Journal of Impact Engineering, 2010 ( 37 ) : 1180- 1187.
  • 9REIFF D, BRADLEY E. A Novel Mechanical Shock Test Method to Evaluate Lead-free BGA Solder Joint Reliability [ C]//Proceedings of the 55th Electronic Components and Technology Conference,2005 : 1519-1525.
  • 10VARGHESE J, DASGUPTA A. Test Methodology for Durability Estimation of Surface Mount Intercormects under Drop Testing Conditions [ J ]. Microelectron Reliability ,2007 (47) :93-103.

引证文献3

二级引证文献9

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部