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ABS/Cu粉导电复合材料性能研究 被引量:8

Performance of ABS/Cu Powder Conductive Composites
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摘要 用熔融共混法制备了3种丙烯腈-丁二烯-苯乙烯共聚物(ABS)/Cu粉复合材料,考察了Cu粉含量、相容剂马来酸酐接枝乙烯-醋酸乙烯(EVA-g-MAH)和四钛酸钾(K_2Ti_4O_9)晶须对ABS/Cu粉复合材料性能的影响。结果表明,ABS/Cu粉复合材料性能的变化符合金属粉末填充聚合物基体的一般规律,Cu粉在质量分数60%左右复合材料出现渗流阈值;EVA-g-MAH的加入,改善了复合材料的力学性能,但在Cu粉质量分数65%时复合材料渗流出现,并且使逾渗区间变窄;K_2Ti_4O_9的加入,提高了复合材料的导电性,在Cu粉质量分数为55%时,复合材料出现渗流同时使逾渗区间变宽,证明了"有效浓度"概念在本研究体系中是成立的。 Three kinds of ABS/Cu powder composites were prepared by melt blending. The effects of the Cu power content, compatibilizer EVA-g-MAH and K2Ti4O9 whisker on the properties of the ABS/Cu powder composites were discussed. The results indicate that the ABS/Cu powder composites accord with the general rule of polymeric conductive composites filled by metal powder. The percolation threshold of the composites appears when Cu powder is about 60%. EVA-g-MAH improves the mechanical properties of the composites, but the percolation threshold of the composites emerges when Cu powder is 65%, and the percolation range becomes narrow. K2Ti4O9 improves conductive property of the composites, the perconlation threshold emerges when Cu powder is 55 %, and the percolation range becomes wide. The experimental fact also gives a support of the concept of effective concentration in this conductive composite system.
出处 《现代塑料加工应用》 CAS 北大核心 2010年第1期13-17,共5页 Modern Plastics Processing and Applications
基金 北京市教委中青年骨干教师培养计划资助项目
关键词 导电复合材料 铜粉 丙烯腈-丁二烯-苯乙烯共聚物 渗流性能 conductive composites copper powder acrylnitrile-butadiene-styrene copolymer percolation performance
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  • 1刘丽娜,张秀斌.改性剂对PVC/稻壳粉木塑复合材料性能的影响[J].塑料工业,2010,38(S1):77-81. 被引量:6
  • 2汤浩,陈欣方,罗云霞.复合型导电高分子材料导电机理研究及电阻率计算[J].高分子材料科学与工程,1996,12(2):1-7. 被引量:54
  • 3张朝发,李焕喜,吕明云.吸波材料与FSS复合的隐身技术研究进展[J].材料导报,2007,21(1):118-121. 被引量:14
  • 4HaoX Y, Gai G S, Yang Y F, Zhang Y H, Nan C W. Development of the conductive polymer matrix composite with low concentration of the conductive filler [J]. Materials Chemistry and Physics, 2008, 109: 15-19.
  • 5Feller J F, Chauvelon P, Linossier I, Glouannec P. Characterization of electrical and thermal properties of extruded tapes of thermoplastic conductive polymer composites (CPC) [J]. Polymer Testing, 2003, 22: 831-837.
  • 6RyszardW, Ryszard P, Aleksy P. Conductive polymer materials with low ftiler content [J]. Journal of Electrostatics, 2002, 56: 55-66.
  • 7Jou W S, Claengb H Z, Hsua C F. The electromagnetic shielding effectiveness of carbon nanotubes polymer composites [J]. Journal of Alloys and Compounds,2007,434/435: 641-645.
  • 8新野正之,平井敏雄,渡边龍三.傾斜機能材料-宁宙機用超耐熱材料を目指して[J].日本复合材料学会誌,1987,13(6):257-264.
  • 9Wen B Y, Wu G, Yu J. A flat polymeric gradient material: Preparation, structure and property [J]. Polymer, 2004, 45 (10): 3359- 3365.
  • 10Bao H D, Guo Z X, Yu J. Effect of electrically inert particulate filler on electrical resistivity of polymer/multi walled carbon nanotube composites [J]. Polymer, 2008, 49: 3826-3831.

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