摘要
对通过改善界面状态提高金刚石-Cu复合材料导热性的研究进行综述。为了改善金刚石与Cu的界面状态,提高二者的结合力,研究者们已经做了大量的工作。从加强界面结合力入手:一种方法是通过金刚石颗粒表面涂覆金属层(即表面金属化)来提高金刚石与Cu的亲和力,在同等条件下,采用表面镀Cu的金刚石与没有镀Cu的金刚石相比,所制备的金刚石-Cu复合材料的导热性增加了近3倍;另一种方法是通过在Cu中添加元素,形成中间碳化物层来增强界面结合力,减小热阻,研究者们分别添加W、Ti、Cr等活性元素,都不同程度地提高了Cu-金刚石复合材料的导热性能。或综合两种方法,同时对基体和增强体进行一定的预处理。其次,减少界面数量,增大金刚石颗粒粒径,尽可能实现并联导热模型以构成复合材料的各相的三维连通,应该都是发掘高导热复合材料导热性能的有效方法。
This paper summarized the solutions mainly to increase the thermal conductivity of the composites by improving the interface state. In order to solve the interface problems between copper and diamond, plenty of investigations on improvement of the diamond-copper wet ability to strengthen their interracial bonding were made. Firstly, the interface bonding between copper and diamond could be enhanced. On the one hand, the application of a metal coating onto diamond particles（ surface metallization） was used to enhance the chemical affinity of diamond and copper. It has been reported that the thermal conductivity of composite with coated particles is nearly three times higher than that of the composite with uncoated particles. On the other hand, some alloying elements have been extensively added to the copper matrix via forming intermediate carbides to intensify interfacial bonding resulting in minimum interface thermal resistance. Some investigations show that the various added alloying elements such as W ,Ti and Cr can ameliorate the thermal conductivity of composite to a different degree. Furthermore, the two methods can be integrated and both copper and diamond particles can be pretreated simultaneously for a better interface performance. Secondly, it will be a effective measure to exploit excellent thermal conductivity composites by reducing the quality of interface and/or adopting bigger size of diamond grains which can form the parallel thermal conductivity model and/or make each phase keep three dimensional connection.
出处
《粉末冶金技术》
CAS
CSCD
北大核心
2010年第2期143-149,共7页
Powder Metallurgy Technology
