摘要
以E44环氧树脂为基料，加入固化剂HD、增强剂、填料等，制备出可在室温下2—3h固化，使用温度达到200℃的胶粘剂体系。适用于钢铁、铝合金及磨料等工件的粘结。成本远低于市场同类产品。
Using E-44 epoxy resin as the base material, by adding curing agent HD, enhancers, fillers, etc. The adhesive system can be prepared at room temperature for 2 -3 h curing, and the using temperature is 200 ℃. It can be applied to steel, aluminum, and bonded abrasives such as the work-piece. The cost is far lower than the market similar products.
出处
《应用化工》
CAS
CSCD
2010年第4期616-617,共2页
Applied Chemical Industry
关键词
环氧树脂
室温固化
高温使用
低成本
epoxy resin
heat-resistant
curable at high temperature
low cost
