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导热环氧灌封胶的研制 被引量:4

Preparation of thermally conductive epoxy potting
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摘要 以环氧AG-80为主体树脂,端羧基液体丁腈橡胶与1,6-己二醇二缩水甘油醚的反应产物为活性增韧稀释剂,纳米AlN为导热填料,缩胺-105为固化剂制备导热灌封胶。实验结果表明,每100份环氧树脂中活性增韧稀释剂为20份时,灌封胶的力学性能、耐热性能良好;纳米AlN的质量分数为12%,灌封胶的热导率达到0.85W/m?k,可满足使用要求。 Using AG-80 epoxy resin as the main resin, reaction product of carboxy terminated butadiene-acrylo nitrile (CTBN) and 1.6-hexanediol diglycidyl ether as the active toughening diluents, nano aluminum nitride (AlN) as the thermal conductive filler and aminal-105 as the curing agent, the thermally conductive potting was prepared. The results indicated that when the amount of active toughening agents is 20 parts per 100 parts of epoxy resin, the mechanical and heat resistant properties of the potting is good, and when the content of heat conductive filler is 12 percents by weight, the thermal conductivity of the potting is 0.85 W/m · k, which can meet the operating requriements.
出处 《粘接》 CAS 2010年第5期48-50,共3页 Adhesion
关键词 环氧树脂 活性增韧稀释剂 导热灌封胶 epoxy resin active toughening diliter thermally conductive potting
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参考文献4

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二级参考文献3

共引文献11

同被引文献18

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