摘要
介绍用于 0 .35μm投影光刻机的逐场调平技术 ,讨论其检测和控制原理 ,并作精度分析 ;讨论逐场调平对套刻精度的影响 ,并建立三轴测量逐场调平的套刻步进模型。
The field- by- field leveling techniques used for 0 .35μm projection stepper is described in the paper.Its testing and control principles are discussed,and the accuracy analysis is carried out.The effect of field- by- field leveling on overlapping accuracy is discussed.An overlapping stepping model for three- axis measurement and field- by- field leveling is set up.
出处
《光电工程》
CAS
CSCD
1998年第A12期42-46,共5页
Opto-Electronic Engineering
关键词
投影光刻机
逐场调平
步进模型
IC
Projection stepper,Field- by- field leveling,Stepping model
