摘要
为了解决芯片测试过程中功耗密度大造成的局部过热(简称"热斑")问题,提出一种热量敏感的多播并行测试方法.对众核芯片采用多播并行测试时面临的"热斑"问题进行分析,提出一种无"热斑"的多播测试路径生成算法;在温度容限内对生成的多条单类同构芯核多播测试路径进行并行优化,形成无"热斑"的快速并行测试方案,同时缩短了测试时间.实验结果表明,采用文中方法能够有效地避免多播并行测试时的"热斑",并使测试时间缩短近45%.
The local overheating problem,which is referred to as hotspot,has become an important problem for parallel testing of many-core chips.This paper proposes a thermal-aware parallel multicast testing method to avoid hotspots.Firstly,we analyze the hotspots caused by parallel multicast test of many-core chips.Based on the above analysis,a heuristic algorithm is proposed to avoid hotspots during the generation of one multicast test access path.Finally,for further reducing the test time,we give an optimal solution of selecting candidate multicast test access paths which can coexist under the thermal constraints.Experimental results show that the hotspots can be eliminated,and the test time can be reduced by approximately 45 percent.
出处
《计算机辅助设计与图形学学报》
EI
CSCD
北大核心
2010年第5期845-851,共7页
Journal of Computer-Aided Design & Computer Graphics
基金
国家自然科学基金重大研究计划(90718037)
国家"八六三"高技术研究发展计划(2007AA01Z113)
博士点基金新教师项目(200803591033)
中国科学院计算机系统结构重点实验室开放课题(ICT-ARCH200704)
关键词
众核芯片
并行测试
多播技术
热斑
many-core chip
parallel testing
multicast
hotspot