摘要
下颌阻生第三磨牙拔除术是牙槽外科一项较为复杂的手术。其术后的主要并发症为拔牙后疼痛、面部肿胀反应、感染、干槽症、拔牙术后出血、颞下颌关节紊乱综合征和开口受限等。半导体激光器发展至今,在诸多领域中都得到了广泛应用。本文通过对激光生物学效应的探讨,对半导体激光在下颌第三磨牙拔除术后并发症预防方面的作用作一综述。
The extraction of mandibular third tooth is a complicated operation in alveolar surgery.The main complications are pain,swelling,infection,dry socket,bleeding,temporomandibular joint disorders and restrict opening.Semiconductor laser is widely used in a good many fields.The review discusses the mechanism of semi-conductor laser and summarizes effectiveness in the prevention of postoperative complication after mandibular third tooth extraction.
出处
《国际口腔医学杂志》
CAS
2010年第3期355-358,共4页
International Journal of Stomatology
关键词
半导体激光
下颌第三磨牙
并发症
semiconductor laser
mandibular third tooth
complication
