摘要
SnCu共晶钎料在波峰焊领域被公认为SnPb共晶及近共晶钎料的最佳替代合金之一,但其熔点高,力学性能不良。本文采用合金化原理,在Sn0.7Cu合金中添加微量的Ag形成SnCuAg三元合金来改善合金性能。结果表明:当Ag质量分数小于0.2%时,随Ag含量增加,SnCuAg钎料抗拉强度和剪切强度逐渐提高;当Ag质量分数为0.2%时,SnCuAg抗拉强度较基体提高35.5%,剪切强度较基体提高46.5%。当Ag质量分数大于0.2%时,钎料合金的力学性能有所下降,这主要与新相Ag3Sn弥散强化作用及母材界面金属间化合物有关。
SnCu eutectic solder has been internationally recognized as one of the best substitutes for eutectic and near-eutectic SnPb solder alloy in the wave soldering areas.But the melting point of SnCu solder is high and mechanical properties are poor.In this paper,trace Ag was added into Sn0.7Cu alloy to improve the alloy properties.The results show that mechanical properties of the SnCuAg solder are gradually increased with the increasing of Ag when the mass fraction of Ag is less than 0.2%.When the mass fraction of Ag is 0.2%,the tensile strength and shear strength of the SnCuAg are respectively increased by 35.5% and 46.5% compared to the matrix solder.When the mass fraction of Ag is more than 0.2%,the mechanical properties of the solder alloys are decreased a little,which mainly is related to the dispersion strengthening effect of the new phase Ag3Sn and the substrate intermetallic compounds.
出处
《河南科技大学学报（自然科学版）》
CAS
北大核心
2010年第3期4-7,共4页
Journal of Henan University of Science And Technology:Natural Science
基金
国家科技重大专项基金子项目(2009ZX04014-065)
河南省高校科技创新人才支持计划项目(2010HASTIT032)
