摘要
介绍了电子器件灌封材料的种类,阐述了环氧、有机硅灌封材料的组成、特性、应用现状、存在的问题及其性能优化改性的方法。分析了传统灌封材料的缺陷,指出了研制绝缘导热灌封材料的作用。采用对有机硅进行接枝改性并用AlN作为无机填料制成复合灌封材料的方案,指出了电子器件灌封材料的发展趋势。
This paper introduces the kinds of potting materials for electron devices.It elaborates the component,properties,application status,existing problems and method to improve the properties of epoxy potting materials and organic-silicon potting materials.One analyzes the defects of the traditional potting materials and points out the goal and meaning to investigate the insulating heat conduction materials.It uses organic-silicon and inorganic filling AlN powders to fabricate the compound materials.One points out the development trend of potting materials for electron device.
出处
《实验科学与技术》
2010年第3期20-22,33,共4页
Experiment Science and Technology
关键词
电子器件
灌封材料
环氧
有机硅
无机填料
electron device
potting materials
epoxy
organic-silicon
inorganic filling
