摘要
采用直流电沉积技术制备电解铜箔,利用SEM、微机控制电子万能试验机和高温拉伸机研究不同RE含量(0、1.5×10-3%、3×10-3%、4.5×10-3%)对电解铜箔组织及性能的影响。结果表明,RE元素的加入可以细化晶粒,使晶粒均匀致密,并能改善铜箔的力学性能,加入3×10-3%左右的RE,晶粒细化效果最好,力学性能最高。
Electrodeposited copper foil was prepared by direct current electrodeposited method,and effects of different RE additions,including 0,0.0015%,0.003% and 0.0045%,on microstructure and properties of the copper foil were investigated by SEM (scanning electron microscope),micro-computer control electronic universal testing machine and high temperature tensile machine.The results show that RE element can obviously improve mechanical properties of the copper foil by refining and uniformly distributing grain size in the foil,where ideal grain size in the copper foil with maximum value of mechanical properties can be obtained with approximately 0.003% RE addition.
出处
《特种铸造及有色合金》
CAS
CSCD
北大核心
2010年第7期658-660,共3页
Special Casting & Nonferrous Alloys
基金
科技部科技人员服务企业行动项目(2009GJC50041)
江铜-耶兹铜箔有限公司与南昌大学合作研究项目
关键词
电解铜箔
RE含量
微观组织
力学性能
Electrodeposited Copper Foil,RE Addition,Microstructure,Mechanical Properties
