摘要
采用正交设计试验，确定了利用Ｋａｐｔｏｎ胶膜粘接模块的最佳工艺条件，并对粘接样品各项性能进行了测试。
This paper details how to design an orthogonal test and experiment.A optimum technology for adhesive bond of module by Kapton adhesive film was defined ,and varied properties of adhesive sample plates was tested.
出处
《粘接》
CAS
1999年第3期31-32,共2页
Adhesion
