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体硅湿法腐蚀中(110)衬底上的凸角补偿方法 被引量:1

Compensation method for convex corners on(100) substrate in bulk silicon wet etching process
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摘要 从硅晶胞的空间原子结构出发,对(110)衬底进行研究,提出了针对(110)衬底上规则目标凸角结构的通用补偿方法.以(100)衬底上已提出的图形分析和共性补偿方法为依据,确定了(110)衬底表面特征晶向的平面关系,将所选70℃30%(质量分数)的KOH腐蚀液条件下的特征晶面(111)、(311)以及与衬底同簇的(110)晶面与衬底相交,得到平面特征晶向,从而构建补偿图形的拓扑框架,最终选择拓扑框架中的部分晶向构成具体的补偿图形.利用各向异性三维仿真软件对由该方法设计得到的补偿结果进行验证,模拟结果与设计预期相一致,充分证实了该设计方法的正确可行. Based on the research on(110) faced silicon substrate,a novel theoretical method which can generate perfect compensation patterns for regular convex corners is put forward.This method starts with the previous work on the basic truth of silicon atomic structure and the compensation method of(100) substrate.By refitting the intersection lines with the substrate of key related faces,such as(111),(311) and(110) in 70℃ 30% KOH solution,a topological field is formed.The practical compensation patterns are transformed from the topological field within the restriction of detailed rules.This design method is verified by the computer simulation under two different modes.The simulation results are in accord with the design anticipation,which proves the validity of the method.
作者 张涵 李伟华
出处 《东南大学学报(自然科学版)》 EI CAS CSCD 北大核心 2010年第4期750-754,共5页 Journal of Southeast University:Natural Science Edition
基金 国家高技术研究发展计划(863计划)资助项目(2007AA04Z342)
关键词 (110)衬底 凸角补偿 拓扑结构 通用方法 (110) substrate convex corner compensation topological field general method
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参考文献9

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