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交流电化学沉积铜纳米线阵列及其机理探讨 被引量:7

AC Electrochemical Deposition of Cu Nanowire Arrays and Its Mechanism
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摘要 利用二次阳极氧化的方法制备孔高度有序的阳极氧化铝(AAO)为模板,采用交流电化学沉积方法,在AAO模板孔道内制备Cu纳米线。采用扫描电子显微镜(SEM)、透射电子显微镜(TEM)和X射线衍射仪(XRD)对Cu纳米线的形貌、晶体结构进行研究。结果表明:模板的孔径均匀,孔道平直。Cu纳米线均匀分布在AAO模板纳米孔隙中,直径均一,并沿Cu(Ⅲ)晶面择优生长;AAO模板孔道生长铜纳米线不光滑,成凹凸状,并对此沉积机理进行探讨。 Cu nanowire arrays were prepared by alternating current(AC) electrochemical deposition method in anodic aluminum oxide(AAO) templates with highly ordered pores processed by secondary anodic oxidation.The morphology and structure of Cu nanowires were characterized by SEM,TEM and XRD,respectively.The results indicated that Cu nanowires preferred orientation along(Ⅲ) had uniform distribution in Cu/AAO nano-composite thin films.The Cu nanowires had a structure of parallel bright stripes alternating with parallel dark stripes.The mechanics of ac-electro-deposition was discussed.
出处 《材料工程》 EI CAS CSCD 北大核心 2010年第8期20-23,共4页 Journal of Materials Engineering
基金 武汉市青年科技晨光计划资助项目(20065004116-35)
关键词 交流电化学沉积 阳极氧化铝模板 铜纳米线阵列 alternating current electrochemical deposition anodic aluminum oxide template copper nanowires array
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参考文献10

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