摘要
利用化学镀方法在聚苯胺复合织物表面均匀沉积金属铜,以改善复合织物的导电性能。探讨了化学镀条件(主盐硫酸酮、还原剂甲醛、络合剂、氢氧化钠用量、基质、时间和温度)对复合织物方阻、金属沉积速率及结合性能的影响。优化的化学镀工艺为:CuSO45g/L,酒石酸钾钠30g/L,NaOH6g/L,HCHO24mL/L,化学镀温度45℃,时间15min。
To improve the performance of composite conducting fabric, electroless plating was used during depositing copper. Influences of electroless plating conditions such as dosage of copper sulfate,formaldehyde, complexing agent, sodium hydroxide, substrate, time and temperature on square resistance, rate of metal deposition and binding properties were discussed. Optimum electroless ptating conditions were temperature 45 ℃, time 15 minutes with copper sulfate 5 g/L, potassium sodium tartrate 30 g/L, sodium hydroxide 6 g/L and formaldehyde 24 mL/L.
出处
《印染》
北大核心
2010年第18期1-4,8,共5页
China Dyeing and Finishing
基金
教育部科学技术研究重点项目(No.109066)
上海市引进技术的吸收与创新项目(08-118)
