摘要
分别用A95钨合金、A80钨合金、C103铌合金及三者的焊接组合作为C/SiC与TC4钛合金异质连接的过渡层,采用扫描电子显微镜、X射线衍射对过渡层与C/SiC的界面进行微观组织及结构分析,并对相应的封接件进行气密性及拉伸性能测试。结果表明,采用A95,A80钨合金作过渡层时,钨合金与C/SiC界面为冶金结合,界面产物为TiC,TiSi,Cu4Ti和Cu3Ti等;而采用三者的焊接组合作过渡层时,过渡层的热膨胀系数呈梯度变化且界面均为冶金结合,使C/SiC与TC4钛合金封接件具有高的气密性和抗拉强度(62.21 MPa),实现良好异质连接。
By using A95 W-alloy, A80 W-alloy, C103 Nb alloy and the joining of these alloys as transition material to relieve thermal stress, the joint of C/SiC and TC4 Ti-alloy were acquired. The interfacial microstructure and element distribution were investigated by SEM, EDS and XRD methods. The airtightness and tensile-strength of the joint of C/SiC and TC4 Ti-alloy were tested. Experimental results show that there are TiC-type, TiSi-type, Cu4Ti-type and Cu3Ti-type phases distributing in the metallurgical interface generated by the active brazing of C/SiC and A95, A80 W-alloy. However a strong joint with high airtightness of TC4 was acquired by using the transition layer of the joining of A95 W-alloy, A80 W-alloy, C103 Nb-alloy because of metallurgical interface and the expansion coefficient changing in gradient through the whole joint.
出处
《真空电子技术》
2010年第4期30-33,38,共5页
Vacuum Electronics
