摘要
在软钎焊免清洗助焊剂中分别添加了3种不同含量的非离子表面活性剂:TritonX—100、Tween—20和PEG2000,得到了3组助焊剂。使用这3组助焊剂和Sn0.7Cu无铅钎料在纯铜板上进行了铺展测试。结果表明,添加TritonX—100和添加Tween—20的质量分数均为0.6%时,钎料的润湿角最小值分别为30.07°和29.70°,铺展面积最大值分别为56.67mm2和58.53mm2;添加PEG2000质量分数为0.3%时,钎料的润湿角最小值为26.70°,铺展面积最大值为66.88mm2,比未添加时增加26.9%。适量加入非离子表面活性剂能够改善助焊剂的润湿性,并提高无铅钎料的铺展能力。
Three kinds of nonionic surfactants（Triton X—100,Tween—20 and PEG2000） were added into the no-clean soldering fluxes,thus three groups of fluxes were gained.Experiments of solder spreadability were carried out on the pure copper plates with three groups of fluxes and Sn0.7Cu lead-free solder.The results show that when the mass fraction of nonionic surfactants Triton X—100 and Tween—20 both are 0.6%,the minimum wetting angles are 30.07° and 29.70°,respectively,and the maximum spread areas are 56.67 mm2 and 58.53 mm2,respectively.When the mass fraction of PEG2000 is 0.3%,the minimum wetting angle is 26.70° and the maximum spread area is 66.88 mm2 which is increased by 26.9% compared with that of the soldering flux with no PEG2000 addition.It is obvious that appropriate addition of nonionic surfactants can improve the wettability of soldering flux and enhance the spreadability of the lead-free solder.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2010年第9期33-36,40,共5页
Electronic Components And Materials
基金
河南理工大学博士基金资助项目
河南理工大学金属材料及加工工程学科发展基金资助项目
