摘要
在高电流密度下用直流电沉积法制备了电解铜箔。电解液基础成分为:Cu2+80～90g/L,H2SO4120～130g/L和Cl-30～40mg/L。用正交试验法研究了聚乙二醇、2–巯基苯并咪唑、硫脲、明胶等4种添加剂对电解铜箔力学性能的影响。最佳配比为:聚乙二醇0～5.5mg/L,2–巯基苯并咪唑0～6.0mg/L,硫脲0～3.0mg/L,明胶0～4.5mg/L。由此制备的铜箔,其常温抗拉强度与延伸率分别是411.3MPa和9.3%,高温抗拉强度与延伸率分别是209.2MPa和2.9%。
Electrolytic copper foils were prepared by direct current electrodeposition at high current density. The electrolyte is mainly composed of Cu^2＋ 80-90 g/L, H2SO4 120-130 g/L and Cl^- 30-40 mg/L. The effects of four kinds of additives such as polyethylene glycol （PEG）, 2-mercapto- benzimidazole （M）, thiourea （TU） and gelatin on the mechanical properties of electrolytic copper foil were studied. The optimal formulation is as follows： PEG 0-5.5 mg/L, M 0-6 mg/L, TU 0-3 mg/L, and gelatin 0-4.5 mg/L. The tensile strength and elongation of copper foil at room temperature is 411.3 MPa and 9.3%, respectively, while at high temperature they are 209.2 MPa and 2.9%, respectively.
出处
《电镀与涂饰》
CAS
CSCD
北大核心
2010年第11期26-28,共3页
Electroplating & Finishing
基金
科技部科技人员服务企业行动项目(2009GJC50041)
江铜-耶兹铜箔有限公司与南昌大学合作研究项目
关键词
电解铜箔
添加剂
正交试验
力学性能
electrolytic copper foil
additive
orthogonal test
mechanical property
