摘要
通过金相、扫描电镜分析和物理性能测试等手段，对化学镀铜石墨粉－铜基复合材料的制备、组织、性能进行了研究。结果表明：在粒度４～６μｍ石墨表面可均匀地涂覆金属铜，在合理的压制压力和烧结温度下，复合材料的组织均匀和致密，石墨在基体中均匀弥散分布，金属铜形成细小的三维网络搭接。
In this paper, by means of the analyses of SEM and metallograph and physical tests,the microstructure, properties and preparation of the composite made from copper coated graphite with copper by chemical plating have been studied. The result shows that when the molding pressure and sintered temperature are optimal, the composite has a homogeneous structure and a high density with wide scattered graphite and three dimensional metal lattice. This structure strikingly improved electrical conductivity.
出处
《合肥工业大学学报（自然科学版）》
CAS
CSCD
1999年第1期35-38,共4页
Journal of Hefei University of Technology：Natural Science
基金
国家自然科学基金
