摘要
总结了SEM/EDX和FTIR在手机电触点失效分析中的几个典型案例,发现大量失效产品中的镀金触点因表面污染和氧化引起的接触电阻升高是造成电接触故障的主要原因。污染物形貌和成分复杂,通过与手机生产和使用中常见污染源的红外图谱和EDX图谱进行对比,SEM/EDX和FTIR能鉴别出大多数污染物,比如印刷线路板在切板过程中引起的碎屑、手指接触污染、灰尘聚集污染以及工艺带入的粘胶污染等,促进了工艺的改进和生产效率的提高。
Some typical cases on electrical contact failure analysis by SEM/EDX and FTIR were summarized.It is found that the main failure cause of the electrical contacts is the rise of electric resistance caused by surface contamination and oxidation.Generally,the contaminants have complex appearance and composition.Using SEM/EDX and FTIR,most of the contaminants introduced in the course of production and service can be identified,such as scraps,man-made contaminants,dusts,and viscose contaminants.
出处
《失效分析与预防》
2010年第2期114-118,共5页
Failure Analysis and Prevention
