摘要
介绍了半导体行业的发展,晶圆激光划片技术的特点、激光划片系统的组成与其在实际过程中应用。
Introduces the development of semiconductor industry,the characteristic of laser wafer dicing technology,the structure of laser wafer dicing machine,and the application in the production.
出处
《电子工业专用设备》
2010年第12期39-43,共5页
Equipment for Electronic Products Manufacturing
关键词
半导体封装
晶圆
激光划片
Semiconductor encapsulation
Wafer
Laser wafer dicing
