期刊文献+

熔滴喷射关键参数测控系统设计

Design of a Measurement and Control System for the Key Parameters in Molten Droplet Ejection
下载PDF
导出
摘要 熔滴喷射装置内的温度、气体压力及激振频率直接影响熔滴喷射质量。以LabVIEW为开发平台开发的熔滴喷射的关键参数测控系统,通过RS—232串口实现了计算机与传统仪器的信息传送。以DAQ卡PCL—818L为基础,完成了对过程变量的检测,并通过改进实际PID控制器和利用LabVIEW内嵌的PID控制工具包,实现了对温度的精确控制。 In the process of molten droplet ejection,the quality of the droplets is affected by some key parameters,such as temperature,gas pressure,actuator frequency.A measurement and control system for molten droplet ejection has been developed based on LabVIEW.This system communicates with traditional instrument through RS—232 serial port,measures process variable using PCL—818L.By improving actual PID controller,this system realizes temperature precise control in virtue of PID control toolkit in LabVIEW.
出处 《科学技术与工程》 2010年第35期8844-8848,共5页 Science Technology and Engineering
基金 国家高技术研究发展计划项目(2008AA03A238) 国家自然科学基金项目(51005186) 西北工业大学研究生创业种子基金项目(Z2010016)资助
关键词 LABVIEW 数据采集 PID控制 串行通信 LabVIEW data acquisition PID control serial communication
  • 相关文献

参考文献7

  • 1Wallace D,Hayes D,Chen T,et al.Ink-Jet as a MEMS manufacturing tool.ASME Conference Proceedings,2007; 2007(42657):1161-1168.
  • 2Zeng X H,Qi L H,Huang H,et al.Experimental research of pneumatic drop-on-demand high temperature droplet deposition for rapid prototyping.Key Engineering Materials,2010; 419-420:405-408.
  • 3田德文,田艳红,王春青,孔令超.均匀钎料熔滴喷射装置设计[J].机械工程学报,2008,44(12):163-167. 被引量:4
  • 4Armster S Q,Delplanque J P,Lai W H L,et al.Monosize droplet depostion as a means to investigate droplet behavior during spray deposition.Metallurgical and Materials Transactions B,2000; 31(6):1333-1344.
  • 5白美卿,高富强.电阻炉炉温控制中的可控硅触发技术[J].自动化仪表,1996,17(2):28-31. 被引量:16
  • 6Advantech corporation.32-bit LabVIEW drivers user's guide (2st edition).Advantech Corporation,2000.
  • 7蔡春桥,王永军,王俊彪,李峰.电阻炉温度控制系统的设计与实现[J].科学技术与工程,2007,7(10):2379-2382. 被引量:15

二级参考文献18

  • 1杜静,王振民.模糊PID在电阻炉温度控制系统中的应用[J].机械管理开发,2005,20(2):47-48. 被引量:12
  • 2刘海霞,雷永平,夏志东,韩飞.切丝重熔法制备的BGA焊球及其表面形貌[J].电子元件与材料,2005,24(5):21-23. 被引量:10
  • 3刁心玺,杨飞.微机控制的八路双方式可控硅调功器[J].电子技术应用,1989,15(11):9-11. 被引量:2
  • 4TUMMALA R R, SUNDARAM V, LIU Fuhan, et al. High density packaging in 2010 and beyond [C]// The Institute of Electrical and Electronics Engineers. The 4th International Symposium on Electronic Materials and Packaging, December 4-6, 2002, I-Shou University, Kaohsiung, Taiwan. Piscataway, NJ: IEEE, 2002: 30-36.
  • 5ASM International Handbook Committee. Metals handbook, Vol. 7, powder metallurgy [M]. 9th ed. Metals Park: ASM International, 1984.
  • 6HAUSNER H H, ANTES H W, SMITH G D. Modem developments in powder metallurgy[M]. Princeton: Metal Power Industries Federation, 1980.
  • 7ANDERSON R. Powder metallurgy at pratt and whitney [J]. International Journal of Powder Metallurgy, 1990, 26(2): 111-118.
  • 8YIM P, CHUN J H, ANDO T, et al. Production and characterization of mono-sized Sn-Pb alloy balls[J]. International Journal of Powder Metallurgy, 1996, 32(2): 155-164.
  • 9FROHN A, ROTH N. Dynamics of droplets[M]. Berlin: Springer, 2000.
  • 10BRANDENBERGER H, NUSSLI D, PIECH V, et al. Monodisperse particle production: A method to prevent drop coalescence using electrostatic forces[J]. Journal of Electrostatics, 1999, 45(3): 227-238.

共引文献32

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部