摘要
针对传统方法检测电子元件引线可焊性的缺点,提出了一种干法测量方法。电子元件引线镀层表面的金属氧化物是影响可焊性的主要因素,金属氧化物具有介于绝缘体和半导体之间的物理特性,它的击穿电压和氧化程度成正相关的关系。实验证明:击穿电压低于3V时,焊接性能很好,随着击穿电压升高,焊接性能恶化,超过40V,完全丧失可焊性。因此可以通过测量元件引线金属氧化物的击穿电压,判断其氧化程度,进而对元件引线的可焊性进行量化评估。同时,指出了干法测量的关键问题,给出了一种测量元件引线击穿电压的实现方案。
For the shortcomings of the traditional methods in testing solderability of electronic component leads,a dry-method was proposed.The main factor of affecting the solderability is metal oxides of the coating on electronic components leads.The metal oxides physical property is in between of insulator and semiconductor.The relationship of its breakdown voltage and the oxidation degree was positive correlation.Experiments show that there is a good solderability when the breakdown voltage is less than 3 V.The solderability becomes bad with the breakdown voltage going up,if it is higher than 40 V,the solderability is completely lost.So the oxidation degree could be determined by measuring the breakdown voltage of the metal oxides,then assess the solderability of the component leads in quantity.Meanwhile,the key question of the dry-method was pointed out and an implementation scheme of measuring breakdown voltage was given.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2011年第1期72-74,共3页
Electronic Components And Materials
基金
河北省科技支撑计划资助项目(No.10212113D)
关键词
可焊性
电子元件引线
金属氧化物
击穿电压
solderability
electronic component leads
metal oxides
breakdown voltage
